Showing results: 226 - 237 of 237 items found.
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784743-01 -
NI
The REM‑11152 is a digital input module for remote I/O. Remote I/O systems are low-cost, modular systems for simple machine control and measurements. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the REM‑11152 from a real-time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low-cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high-speed or specialty measurements. The REM‑11152 features 2‑, 3‑, and 4‑wire spring terminal connection methods, a built-in power supply for sensors, and an adjustable filter time to improve measurement quality. You can use inputs as counters or standard digital inputs.
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784748-01 -
NI
2-, 3-, 4-Wire, 4-Channel Voltage Input Module for Remote I/O - The REM‑11100 is a voltage input module for remote I/O. Remote I/O systems are low-cost, modular systems for simple machine control and measurements. A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the REM‑11100 from a real-time controller, such as a CompactRIO Controller or an Industrial Controller. You can use remote I/O hardware to add low-cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high-speed or specialty measurements. This module features 2‑, 3‑, and 4‑wire spring terminal connection methods, a built-in power supply for sensors, four selectable input ranges, and simultaneous sampling.
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FX-942 -
YesTech, Inc.
Nordson YESTECH’s advanced multiple camera imagingtechnology offers high-speed PCB inspection with exceptionaldefect coverage. With dual sided top down viewing camera, fourside viewing cameras and 3D inspection, the FX-942 inspectssolder joints and verifies correct part assembly in pre wave orpost wave applications enabling users to improve quality andenhance yield. Advanced Fusion Lighting and newly available image processing technology integrate several techniques, including 3D inspection, color inspection, normalized correlation and rule-based algorithms, to provide complete inspection coverage with an unmatched low false failure rate. Configurable for all line positions, the FX-942 is equally effective for paste, pre/post-wave and final assembly inspection. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
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XM Bond HR -
Viscom AG
Viscom AG offers the new XM Bond HR camera module for dependable inspection of wire bonds. Its characteristics include a 21 mm x 21 mm field of view size and exceptionally fine detail resolution. It is ideally suited for the most precise inspection of thin wires in the production line. With the new XM Bond HR camera module, Viscom advances the configuration possibilities in wire bond inspection for higher in-line inspection quality. This module is particularly recommended for safety-relevant electronics, where thin wires with diameters of e.g. only 20 µm are installed. Products of this kind find use, among others, in various types of signal processing in the automotive and aerospace sectors. The high-quality optical components and sensor chips with first-class resolution and sensitivity achieve superb image quality and sharp detail resolution. Together with its 21 mm x 21 mm field of view size, the XM Bond HR offers a resolution of 4.5 µm per pixel. A telecentric lens ensures that regardless of the distance to an object, an inspection window has the same image scale; for example, the end points of an inspected thin wire are always located at the same positions in the inspection window. In addition, the telecentric optics also prevent areas on the electronic assembly next to tall components from being hidden.
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Tau® 2 -
Teledyne FLIR
Made in USA, the Tau® 2 OEM thermal imaging cameras offer an unmatched combination of features and reliability, making them well-suited for demanding applications including unmanned vehicles, thermal sights, and handheld imagers. Improved electronics provide powerful image processing modes that dramatically improve detail and contrast through continuous histogram equalization. Radiometry is available in every pixel for both 640 × 512 and 336 × 256 resolutions and all three camera grade levels. All Tau 2 configurations share electrical, mechanical, and optical interfaces allowing integrations to be designed that work seamlessly with all formats. Available in Commercial, Performance, and Industrial variants, each with unique sensitivity and pixel operability thresholds to meet operational requirements. Radiometry is an optional feature for Performance-grade cameras, and standard feature with Industrial-grade. All Tau 2 configurations and resolutions share electrical, mechanical, and optical interfaces allowing integrations to be designed that work seamlessly with all formats.
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NI
Digital Modules for Remote I/O provide 24 V digital inputs or outputs and offer 1‐, 2‐, 3‐, and 4‐wire spring terminal connection options. You can use inputs as counters or standard digital inputs, and you can adjust filter time to improve measurement quality. Inputs can include a built‐in power supply for sensors. Output modules feature circuit and overload protection and can drive up to 500 mA per channel, up to 8 A per module.A remote I/O system consists of an EtherCAT bus coupler and individual modules mounted on a DIN rail. You control the Digital Module for Remote I/O from a NI real‐time controller. You can use remote I/O hardware to add low‐cost I/O for simple tasks while your controller handles advanced tasks such as image processing, motion control, and high‐speed or specialty measurements.
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IRT303 -
Wuhan JOHO Technology Co., Ltd
Long-range Surveillance Thermal Imaging Camera IRT303IRT303 is extremely compact, durable uncooled day/night system, operating in 8-14 um waveband, with DDE image processing technology and high sensitivity, it is ideal for quick and accurate situational awareness in a variety of defense and security applications. It specially equipped with Dual-FOV, the wide FOV for find object in wide scope and then fast switch to narrow FOV looking at the target for details. IRT303 is the optimal device for super long observation purpose and target acquisition.ApplicationsLong distance surveillance or patrolLand border and coast surveillanceMarine navigation or rescueTechnical DataDetector Detector material Uncooled FPA Spectral range 8~14 m Pixels 320x240 Pitch 38 mx38 m NETD 50mK@25 C (f/0.7) Optics Lens 135mm/45mm FOV 5.2 3.9 /15.4 11.6 Focusing Motorized Optional lens 100mm/25mm, 120mm/40mm, 150mm/50mm, 180mm/60mm Image Presentation Video output 25Hz PAL/30Hz NTSC Electronic Zoom x2 Polarity BH/WH inverse Brightness & Contrast Auto/ Manual Gain Composition Auto/ Manual Power system Power supply 110~240VAC 9~14VDC (typical: 12VDC) Interfaces Command interface RS232 /RS485/ RS422 alternative Digital video interface(Optional ) Ethernet/LVDS/CameraLink Environmental Ambient temperature -40 C~+60 C Storage temperature -45 C~+60 C Range Performance Detection Range (2.3mx2.3m vehicle) 5500m Recognition Range (2.3mx2.3m vehiclet) 1800m Detection Range (1.8mx0.5m human) 2200m Recognition Range (1.8x0.5m human) 580m
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MVTec Software GmbH
In the industrial environment, especially in digitalized, automated production scenarios, more and more so-called embedded systems are being used. Embedded devices are small, with compact dimensions, highly efficient, and generate little waste heat. Therefore, they are also suitable for limited space conditions. Due to often harsh environmental conditions, they must be particularly robust and resistant to external influences like massive dust accumulation, strong vibrations, and high humidity or even direct contact with water. Typically, embedded devices are handhelds, smartphones, tablets, vision sensors, smart cameras, smart sensors and single board computers. If the systems have integrated machine vision software, they can be used for a wide range of image processing applications. This is known as embedded vision.
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ADLINK Technology Inc.
Embedded vision systems, also referred to as compact vision systems, offer an alternative to Smart cameras and computer-based systems. The ADLINK EOS series is a complete embedded system that offers image acquisition, processing, archiving, and display capabilities. It is equipped with a multi-core CPU, ideal for applications requiring high computing power and multi-camera imaging, such as 3D vision and robotics guidance. Featuring rich I/O connectivity with factory-floor networks, including RS-232/422/485, USB, and isolated digital I/O, as well as onboard storage, ADLINK’s embedded vision system is ready to deploy. A system monitoring feature, feeding back temperature and voltage data, combines with a watchdog timer to maximize robustness and reliability of the ADLINK EOS series in mission critical applications.
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xiD -
XIMEA GmbH
*Quality components - Sony "EXview HAD CCD II" sensors delivering 2.8, 6.1, 9.1 and 12 Mpix*Fastest - Highest speed using full 4 TAP readout potential*Industry standard interface - Compliant with USB 3.0 SuperSpeed specification*Versatile mini camera - Subtle 60 x 60 x 39 mm, 320 grams (1)*Power - Lowest power consumption starting at 3 Watt, bus powered with USB3 cable*Cool - Minimal heat dissipation with passive COOLing*Compatibility - USB 3.0 support for Windows 7 and 10, macOS, Linux, ARM and 30 Libraries*Connectivity and Synchronization - Programmable opto-isolated input and output, 3 status LEDs*Bandwidth potential - 5Gb/s interface 400Mpix/s data throughput*Software interfaces - GenICam / GenTL and highly optimized xiAPI SDK for Image Processing*High grade - Quality class of sensors is combined with specially selected IR filters *Easy deployment - Range of accessories and widest hardware and software interoperability*Highly Customizable - Available in Board level and with Peltier TE Cooling
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xiX -
XIMEA GmbH
*Smallest camera featuring Sony Pregius™ - Compact with only 26.4 x 26.4 x 31 mm and 30 grams (1)*Fast CMOS - High speed, high frame rate: from 2.3 Mpix at 166 Fps to 50 Mpix at 33 Fps*Cool economy - Low power consumption with under 3 Watt and minimal heat dissipation*All-around support - support for Windows 7 and 10, macOS, Linux, ARM and embedded platforms*Industry standard - Data and control interface complies with PCI Express External Cabling Specifications*Adaptable potential - Available with two flat ribbon flex cable connectors: parallel and perpendicular *Software interfaces - GenICam / GenTL and highly optimized API / SDK for Image Processing*Connectivity and Synchronization - Programmable opto-isolated input and output, 4 status LEDs*Lens control - EF-mount Interface allows remote control of aperture, focus and image stabilization*Highly Customizable - Variety of sensor options including Sony IMX287, IMX273, IMX249, IMX265, IMX264, IMX267, IMX304 available in board level stack for OEM use and with switches and adapters*Interoperability increase - Continuous embrace of new software and hardware partners*Cost efficient - Excellent value through utilization of the newest technologies including Sony Pregius™
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xiQ -
XIMEA GmbH
*Ultra compact mini camera- Only 26.4 x 26.4 x 21.2 mm and mere 27grams (1)*Cool - Low power consumption with 1.0 to 1.8 W and minimal heat dissipation*Fastest - High speed, high frame rate: 500fps at VGA and 90fps at 4Mpix resolutions*AIA standard - USB3 Vision standard compliant*Supported - USB3 under Windows 7 and 10, macOS, Linux, ARM and various Machine Vision Libraries*Industry standard interface - Compatible with USB 3.1 Gen1 SuperSpeed specification*Powerful potential - 5 Gbit/s interface 400 MB/s data throughput*Connectivity and Synchronization - Programmable opto-isolated input and output, 3 status LEDs*Cost efficient - Excellent value for the price, low TCO and fast ROI*Software interfaces - GenICam / GenTL and highly optimized API / SDK for Image Processing*Easy deployment - Range of accessories and widest hardware and software interoperability*Time proven - In production since the end of 2011*User friendly - Intuitive and simple to use API, easy switch from C to CS mount and more*Highly Customizable - Available in Board level (single PCB) and with different connector types
